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2023-05-17Si & Silicon oxide CMP (VTT Technical Research Centre of Finland Ltd)
The object of the tender is an Automatic Chemical Mechanical Polisher (later also “Equipment”), for the polishing of typical films and substrates like Si, Si-compounds, Ge and other typical wafers used in semiconductor industry of 100, 150 and 200mm diameter. The equipment shall be designed with at least two polishing platens with integrated in-situ capable pad conditioning systems, an end-point detection on at least one platen, multi-zone carrier heads for all wafer diameters and a slurry feed system …
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