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2026-05-15
Optical film stress measurement tool (VTT Technical Research Centre of Finland Ltd)
THE OBJECT OF THE TENDER PROCESS The object of the procurement is a 200 mm automated film stress and wafer bow analysis system using a non-contact laser scanning technique for the VTT Micronova cleanroom. The procurement includes a room temperature automated thin-film stress measurement system, cassette load lock, robot to handle the wafers, programmable automatic wafer scanning system, and analysis software. The tool should be designed to be used inside the clean room. The supplier will take to โฆ Nรคytรค hankinnat ยป
THE OBJECT OF THE TENDER PROCESS The object of the procurement is a 200 mm automated film stress and wafer bow analysis system using a non-contact laser scanning technique for the VTT Micronova cleanroom. The procurement includes a room temperature automated thin-film stress measurement system, cassette load lock, robot to handle the wafers, programmable automatic wafer scanning system, and analysis software. The tool should be designed to be used inside the clean room. The supplier will take to โฆ Nรคytรค hankinnat ยป