The object of the tender is an Automatic Chemical Mechanical Polisher (later also “Equipment”), for the polishing of typical films and substrates like Si, Si-compounds, Ge and other typical wafers used in semiconductor industry of 100, 150 and 200mm diameter. The equipment shall be designed with at least two polishing platens with integrated in-situ capable pad conditioning systems, an end-point detection on at least one platen, multi-zone carrier heads for all wafer diameters and a slurry feed system for at least 3 slurries. In addition, a supporting wafer cleaning system either integrated or stand-alone is an optional part of the tendering procedure.
The object of the tender process is described in more detail in the invitation to tender documents.
Määräaika
Tarjousten vastaanottamisen määräaika oli 2023-06-19.
Hankinta julkaistiin 2023-05-17.
Toimittajat
Seuraavat toimittajat mainitaan hankintapäätöksissä tai muissa hankinta-asiakirjoissa:
Kohde Hankinnan laajuus
Otsikko: Si & Silicon oxide CMP
Reg. no 32/206/2023
Tuotteet/palvelut: Erilaiset yleis- ja erikoiskoneet📦
Lyhyt kuvaus:
“The object of the tender is an Automatic Chemical Mechanical Polisher (later also “Equipment”), for the polishing of typical films and substrates like Si,...”
Lyhyt kuvaus
The object of the tender is an Automatic Chemical Mechanical Polisher (later also “Equipment”), for the polishing of typical films and substrates like Si, Si-compounds, Ge and other typical wafers used in semiconductor industry of 100, 150 and 200mm diameter. The equipment shall be designed with at least two polishing platens with integrated in-situ capable pad conditioning systems, an end-point detection on at least one platen, multi-zone carrier heads for all wafer diameters and a slurry feed system for at least 3 slurries. In addition, a supporting wafer cleaning system either integrated or stand-alone is an optional part of the tendering procedure.
The object of the tender process is described in more detail in the invitation to tender documents.
Näytä lisää
Arvioitu arvo ilman arvonlisäveroa: EUR 800 000 💰
1️⃣
Suorituspaikka: Helsinki-Uusimaa🏙️
Hankinnan kuvaus:
“The object of the tender is an Automatic Chemical Mechanical Polisher (later also “Equipment”), for the polishing of typical films and substrates like Si,...”
Hankinnan kuvaus
The object of the tender is an Automatic Chemical Mechanical Polisher (later also “Equipment”), for the polishing of typical films and substrates like Si, Si-compounds, Ge and other typical wafers used in semiconductor industry of 100, 150 and 200mm diameter. The equipment shall be designed with at least two polishing platens with integrated in-situ capable pad conditioning systems, an end-point detection on at least one platen, multi-zone carrier heads for all wafer diameters and a slurry feed system for at least 3 slurries. In addition, a supporting wafer cleaning system either integrated or stand-alone is an optional part of the tendering procedure.
The tool must comply with cleanroom equipment standard safety and contamination requirements.
The tool specs are based on the following factors:
- Polish finishing quality
- Wafer handling without errors and wafer loss
- End-point detection for layer clearing
- Achievable polishing rate profile
The pricing of the equipment will consist of the main price for the minimum tool requirements (“total price of the equipment”) and a separate price for the optional parts, features and efforts. The optional goods offered are not included in the total price of the equipment.
The object of the tender process is described in more detail in the invitation to tender documents.
Näytä lisää Myöntämisperusteet
Laatukriteeri (nimi): Price
Laatukriteeri (painotus): 100
Hinta (painotus): 100
Sopimuksen, puitesopimuksen tai dynaamisen hankintajärjestelmän kesto
Jäljempänä oleva aikataulu on ilmaistu kuukausina.
Kuvaus
Kesto: 12
Tietoa vaihtoehdoista
Vaihtoehdot ✅
Vaihtoehtojen kuvaus:
“The optional parts, features and efforts which are described in more detail in the invitation to tender documents:
- Handling of 4-inch wafers (equivalent...”
Vaihtoehtojen kuvaus
The optional parts, features and efforts which are described in more detail in the invitation to tender documents:
- Handling of 4-inch wafers (equivalent to 100mm)
- Automatic clear wafer processing capability including wafer handling on CMP system
- Standalone or integrated post CMP cleaning system with two individual dual roller PVA brush units, megasonic option and spin dry, at least 1 chemical input, and for standalone additionally: automatic cassette to cassette capability for 6 and 8 wafers with clear wafer handling capability
- 100mm membrane carrier with multi-zone (at least 3) pressure system for material removal profile control with additional independent pressure control on retainer ring
- Maintenance set for 100mm wafer carrier including at least 2 retainer rings and 3 membranes
- Multi zone pad conditioning system, with pressure control for secondary platen
- Recommended set of maintenance parts needed for smooth operation for a period of two (2) years
Offering optional parts, features and efforts are not mandatory.
Näytä lisää Hankinnan laajuus
Tietoa Euroopan unionin rahastoista:
“The procurement Is related to project financed by EU funds (PREVAIL=Partnership for Realization and Validation of AI hardware Leadership).” Kuvaus
Lisätietoja:
“Additional information regarding the section II.2.7) above: Agreement shall enter into force on the latest date of signature by the Parties and shall be in...”
Lisätietoja
Additional information regarding the section II.2.7) above: Agreement shall enter into force on the latest date of signature by the Parties and shall be in force until the Equipment has been delivered and accepted, the user training has been held and agreed payment paid, excluding clauses which legal effects are meant to survive the termination or expiration of the Agreement.
Oikeudelliset, taloudelliset, rahoitukselliset ja tekniset tiedot Osallistumisehdot
Luettelo ja lyhyt kuvaus olosuhteista: As stated in the invitation to tender documents.
Taloudellinen ja rahoituksellinen asema
Luettelo ja lyhyt kuvaus valintaperusteista: Selection criteria as stated in the invitation to tender documents
Tekninen ja ammatillinen pätevyys
Luettelo ja lyhyt kuvaus valintaperusteista: Selection criteria as stated in the invitation to tender documents
Sopimukseen liittyvät ehdot
Sopimuksen täytäntöönpanoehdot: As stated in the invitation to tender documents.
Menettely Toimenpiteen tyyppi
Avoin menettely
Hallinnolliset tiedot
Tarjousten tai osallistumishakemusten vastaanottamisen määräaika: 2023-06-19
09:00 📅
Kielet, joilla tarjoukset tai osallistumishakemukset voidaan jättää: englanti 🗣️
Jäljempänä oleva aikataulu on ilmaistu kuukausina.
Vähimmäisaika, jonka kuluessa tarjoajan on pidettävä tarjous voimassa: 6
Tarjousten avaamista koskevat ehdot: 2023-06-19
09:10 📅
Tarjousten avaamista koskevat ehdot (paikka): Espoo, Finland
Tarjousten avaamista koskevat ehdot (Tiedot valtuutetuista henkilöistä ja avaamismenettelystä):
“The given date is preliminary. VTT reserves the right to change the scheduled date and time.
The opening of tenders shall not be a public event.”
Täydentävät tiedot Lisätietoja
“This notice has links and/or attachments listed in https://www.hankintailmoitukset.fi/en/public/procurement/88362/notice/128903” Arvostelurunko
Nimi: Markkinaoikeus
Postiosoite: Sörnäistenkatu 1
Postitoimipaikka: Helsinki
Postinumero: 00580
Maa: Suomi 🇫🇮
Puhelin: +358 295643300📞
Sähköposti: markkinaoikeus@oikeus.fi📧
URL: http://www.oikeus.fi/markkinaoikeus🌏
Lähde: OJS 2023/S 097-303833 (2023-05-17)
Ilmoitus tehdystä sopimuksesta (2023-10-03) Hankintaviranomainen Nimi ja osoitteet
Alue: Suomi/Finland🏙️
Kohde Hankinnan laajuus
Otsikko: Si & Silicon oxide CMP
32/206/2023
Hankinnan kokonaisarvo (ilman arvonlisäveroa): EUR 868 626 💰
Kuvaus
Hankinnan kuvaus:
“The object of the tender is an Automatic Chemical Mechanical Polisher (later also “Equipment”), for the polishing of typical films and substrates like Si,...”
Hankinnan kuvaus
The object of the tender is an Automatic Chemical Mechanical Polisher (later also “Equipment”), for the polishing of typical films and substrates like Si, Si-compounds, Ge and other typical wafers used in semiconductor industry of 100, 150 and 200mm diameter. The equipment shall be designed with at least two polishing platens with integrated in-situ capable pad conditioning systems, an end-point detection on at least one platen, multi-zone carrier heads for all wafer diameters and a slurry feed system for at least 3 slurries. In addition, a supporting wafer cleaning system either integrated or stand-alone is an optional part of the tendering procedure.
The object of the tender process is described in more detail in the invitation to tender documents.