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2013-12-04PECVD deposition system, Reg. No: 434/060/2013 (VTT Technical Research Centre of Finland)
The object of the tender is a Plasma Enhanced Chemical Vapour Deposition (PECVD) system for 150 and 200 mm wafers, with an automatic cassette-to-cassette loading system. The main processes the equipment will be used for are deposition of silicon oxide and silicon nitride. The equipment must be compatible with standard IC- and MEMS- device processing.
The process specifications of the equipment to be supplied are defined in more detail in the invitation to tender, Annex 5.
The PECVD System will be …
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