Viimeaikaiset hankinnat, joissa toimittaja on mainittu DISCO HI-TEC EUROPE GmbH
2023-04-05AUTOMATIC WAFER GRINDER (VTT Technical Research Centre of Finland Ltd)
The object of the tender is an Automatic Wafer Grinder, capable of thinning Si and SiC, LiNbO3 wafers of 100, 150 and 200mm diameter to varying thicknesses with end-point control, cassette-to-cassette processing, TTV profile control and capability to handle thin wafers 100um thick supported by tape and grind away bonded wafer stacks to within 3 um of a typical interface.
The object of the tender process is described in more detail in the invitation to tender documents.
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