The object of the tender is an an electroplating tool (later also “Equipment”), which can electroplate metallic copper films for use as electrically conducting lines and vias onto 150- and 200 mm silicon wafers typical of the semiconductor industry.
The reference price ("the total price") will consist of the price for the equipment in required minimum configuration described in Annex 1. The optional features are not included in the total price of the equipment.
The object of the tender process is described in more detail in the invitation to tender documents.
Määräaika
Tarjousten vastaanottamisen määräaika oli 2023-06-28.
Hankinta julkaistiin 2023-05-26.
Toimittajat
Seuraavat toimittajat mainitaan hankintapäätöksissä tai muissa hankinta-asiakirjoissa:
Kohde Hankinnan laajuus
Otsikko: Plating (Cu, TSV, UBM)
Reg. no 34/206/2023
Tuotteet/palvelut: Erilaiset yleis- ja erikoiskoneet📦
Lyhyt kuvaus:
“The object of the tender is an an electroplating tool (later also “Equipment”), which can electroplate metallic copper films for use as electrically...”
Lyhyt kuvaus
The object of the tender is an an electroplating tool (later also “Equipment”), which can electroplate metallic copper films for use as electrically conducting lines and vias onto 150- and 200 mm silicon wafers typical of the semiconductor industry.
The reference price ("the total price") will consist of the price for the equipment in required minimum configuration described in Annex 1. The optional features are not included in the total price of the equipment.
The object of the tender process is described in more detail in the invitation to tender documents.
Näytä lisää
Arvioitu arvo ilman arvonlisäveroa: EUR 1 440 000 💰
1️⃣
Suorituspaikka: Helsinki-Uusimaa🏙️
Pääkohde tai suorituspaikka: Espoo
Hankinnan kuvaus:
“VTT is looking for a single electroplating tool (or "equipment") which can electroplate metallic copper and UBM layers for use as electrically conducting...”
Hankinnan kuvaus
VTT is looking for a single electroplating tool (or "equipment") which can electroplate metallic copper and UBM layers for use as electrically conducting lines and vias onto 150- and 200 mm silicon wafers typical of the semiconductor industry. The tool will be installed to the Micronova backend cleanroom. The tool must feature automated execution of recipes and computer controlled automation and datalogging. Wafer handling must be automatic from a 25 wafer cassette (*).
The tool should also have provisions for manually loading wafers to the plating chambers thus allowing nonstandard wafers to be processed. Multiple baths are required: two plating baths must be provided for three Cu-based plating processes (expecting there to be some overlap) and four baths for UBM metal baths for Ni, Sn, SnAg alloy, and indium.
The three Cu-based applications are:
1) Cu-fill TSV (through-silicon-via) with aspect ratio up to 10:1 (10 um diameter and 100 um deep) plated from a conformal Ru or PVD Cu seed,
2) Cu-bump or pillar plating through resist using Cu seed layers, and
3) Damascene RDL plating of ~1 um Cu in etched damascene trenches and vias, also using Ru seed layers.
For the Cu-TSV bath, a membrane within the electroplating cell is required to separate additives from the Cu-anode and thus improve the control and lifetime of the electroplating additives. In addition, the vendor must supply a Vacuum Prewetting chamber to enable wetting of etched TSV with electrolyte before filling, and must be able to demonstrate void-free bottom-up filling of the vias.
Knowledge regarding TSV-fill applications is essential for the tooling to be accepted. Recipe editing and execution using computer control of wafer handling, wafer flow, power supplies, additive management, datalog collection and so on as is typical of the semiconductor industry.
(*) Note that the term ”automatic handling” is reserved for tools which take wafers directly from a standard semiconductor wafer cassette and then return them to the same or similiar cassette (”dry-in, dry-out”).
Näytä lisää Myöntämisperusteet
Laatukriteeri (nimi): Price
Laatukriteeri (painotus): 100
Hinta (painotus): 100
Sopimuksen, puitesopimuksen tai dynaamisen hankintajärjestelmän kesto
Jäljempänä oleva aikataulu on ilmaistu kuukausina.
Kuvaus
Kesto: 12
Tietoa vaihtoehdoista
Vaihtoehdot ✅
Vaihtoehtojen kuvaus:
“The contracting entity may procure the optional features 1) UBM -metals / 4 plating stations and 2) Spray etch chamber, as further described in the Annex 1,...”
Vaihtoehtojen kuvaus
The contracting entity may procure the optional features 1) UBM -metals / 4 plating stations and 2) Spray etch chamber, as further described in the Annex 1, from the contract supplier (see Annex 1).
Offering the optional features is mandatory (!). However, The contracting authority does not undertake to acquire optional features.
Note: Any optional features are not taken into account in the price comparison of tenders.
Näytä lisää Hankinnan laajuus
Tietoa Euroopan unionin rahastoista:
“The procurement is related to EU_PREVAIL-project (Partnership for Realization and Validation of AI hardware Leadership) financed by EU funds.” Kuvaus
Lisätietoja:
“Additional information regarding the section II.2.7) above: Agreement shall enter into force on the latest date of signature by the Parties and shall be in...”
Lisätietoja
Additional information regarding the section II.2.7) above: Agreement shall enter into force on the latest date of signature by the Parties and shall be in force until the Equipment has been delivered and accepted, the user training has been held and agreed payment paid, excluding clauses which legal effects are meant to survive the termination or expiration of the Agreement.
Oikeudelliset, taloudelliset, rahoitukselliset ja tekniset tiedot Osallistumisehdot
Luettelo ja lyhyt kuvaus olosuhteista: As stated in the invitation to tender documents.
Taloudellinen ja rahoituksellinen asema
Luettelo ja lyhyt kuvaus valintaperusteista: Selection criteria as stated in the invitation to tender documents
Tekninen ja ammatillinen pätevyys
Luettelo ja lyhyt kuvaus valintaperusteista: Selection criteria as stated in the invitation to tender documents
Sopimukseen liittyvät ehdot
Sopimuksen täytäntöönpanoehdot: As stated in the invitation to tender documents.
Menettely Toimenpiteen tyyppi
Avoin menettely
Hallinnolliset tiedot
Tarjousten tai osallistumishakemusten vastaanottamisen määräaika: 2023-06-28
12:00 📅
Kielet, joilla tarjoukset tai osallistumishakemukset voidaan jättää: suomi 🗣️
Kielet, joilla tarjoukset tai osallistumishakemukset voidaan jättää: englanti 🗣️
Jäljempänä oleva aikataulu on ilmaistu kuukausina.
Vähimmäisaika, jonka kuluessa tarjoajan on pidettävä tarjous voimassa: 6
Tarjousten avaamista koskevat ehdot: 2023-06-28
12:05 📅
Tarjousten avaamista koskevat ehdot (paikka): Helsinki/ Espoo
Tarjousten avaamista koskevat ehdot (Tiedot valtuutetuista henkilöistä ja avaamismenettelystä):
“The given date is preliminary. VTT reserves the right to change the scheduled date and time.
The opening of tenders shall not be a public event.”
Täydentävät tiedot Lisätietoja
“This notice has links and/or attachments listed in https://www.hankintailmoitukset.fi/en/public/procurement/88770/notice/129532” Arvostelurunko
Nimi: Markkinaoikeus
Postiosoite: Sörnäistenkatu 1
Postitoimipaikka: Helsinki
Postinumero: 00580
Maa: Suomi 🇫🇮
Puhelin: +358 295643300📞
Sähköposti: markkinaoikeus@oikeus.fi📧
URL: http://www.oikeus.fi/markkinaoikeus🌏
Lähde: OJS 2023/S 103-324229 (2023-05-26)
Ilmoitus tehdystä sopimuksesta (2023-10-03) Kohde Hankinnan laajuus
Otsikko: Plating (Cu, TSV, UBM)
34/206/2023
Hankinnan kokonaisarvo (ilman arvonlisäveroa): EUR 1 283 000 💰
Kuvaus
Hankinnan kuvaus:
“The object of the tender is an an electroplating tool (later also “Equipment”), which can electroplate metallic copper films for use as electrically...”
Hankinnan kuvaus
The object of the tender is an an electroplating tool (later also “Equipment”), which can electroplate metallic copper films for use as electrically conducting lines and vias onto 150- and 200 mm silicon wafers typical of the semiconductor industry.
The reference price ("the total price") will consist of the price for the equipment in required minimum configuration described in Annex 1. The optional features are not included in the total price of the equipment.
The object of the tender process is described in more detail in the invitation to tender documents.