The object of the tender process is Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools. The basic use for equipment is to detect particles and other defects and scratches on unpatterned silicon wafers and different materials on silicon surface. The tool must be non-contact and non-destructive for determining particles and defects on the surfaces of specific materials on silicon substrate. Typical materials to be analyzed are semiconductors, oxides, nitrides metals and photoresists. The tool must be compatible with installation in an ISO 4 classified cleanroom. The tool must have an automatic mapping stage control system, and the stage must be suitable for 150 mm- and 200 mm silicon wafers. All parts needed for measuring 150 mm and 200 mm silicon wafers must be included in the offer. The object of the tender process is described in more detail in the invitation to tender documents.
Määräaika
Tarjousten vastaanottamisen määräaika oli 2022-11-17.
Hankinta julkaistiin 2022-10-14.
Toimittajat
Seuraavat toimittajat mainitaan hankintapäätöksissä tai muissa hankinta-asiakirjoissa:
hankintailmoitus (2022-10-14) Kohde Hankinnan laajuus
Otsikko: Sähkölaitteet ja -kojeet
Viitenumero: REG. NO. 50/206/2022
Lyhyt kuvaus:
The object of the tender process is Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The basic use for equipment is to detect particles and other defects and scratches on unpatterned silicon wafers and different materials on silicon surface. The tool must be non-contact and non-destructive for determining particles and defects on the surfaces of specific materials on silicon substrate. Typical materials to be analyzed are semiconductors, oxides, nitrides metals and photoresists.
The tool must be compatible with installation in an ISO 4 classified cleanroom. The tool must have an automatic mapping stage control system, and the stage must be suitable for 150 mm- and 200 mm silicon wafers. All parts needed for measuring 150 mm and 200 mm silicon wafers must be included in the offer.
The object of the tender process is described in more detail in the invitation to tender documents.
The object of the tender process is Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The basic use for equipment is to detect particles and other defects and scratches on unpatterned silicon wafers and different materials on silicon surface. The tool must be non-contact and non-destructive for determining particles and defects on the surfaces of specific materials on silicon substrate. Typical materials to be analyzed are semiconductors, oxides, nitrides metals and photoresists.
The tool must be compatible with installation in an ISO 4 classified cleanroom. The tool must have an automatic mapping stage control system, and the stage must be suitable for 150 mm- and 200 mm silicon wafers. All parts needed for measuring 150 mm and 200 mm silicon wafers must be included in the offer.
The object of the tender process is described in more detail in the invitation to tender documents.
Ilmoituksen metatiedot
Alkukieli: englanti 🗣️
Asiakirjatyyppi: hankintailmoitus
Sopimuksen luonne: Tavarat
Asetus: Euroopan unioni ja WTO-maat
Yhteinen hankintanimikkeistö (CPV)
Koodi: Sähkölaitteet ja -kojeet📦 Suorituspaikka
NUTS-alue: Manner-Suomi
🏙️
Menettely
Menettelyn tyyppi: Avoin menettely
Tarjouksen tyyppi: Tarjous koskee kaikkia eriä
Myöntämisperusteet
Kokonaistaloudellisesti edullisin tarjous
The given date is preliminary. VTT reserves the right to change the scheduled date and time.
The opening of tenders shall not be a public event.
Kohde Hankinnan laajuus
Lyhyt kuvaus:
The object of the tender process is Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The object of the tender process is Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The basic use for equipment is to detect particles and other defects and scratches on unpatterned silicon wafers and different materials on silicon surface. The tool must be non-contact and non-destructive for determining particles and defects on the surfaces of specific materials on silicon substrate. Typical materials to be analyzed are semiconductors, oxides, nitrides metals and photoresists.
The basic use for equipment is to detect particles and other defects and scratches on unpatterned silicon wafers and different materials on silicon surface. The tool must be non-contact and non-destructive for determining particles and defects on the surfaces of specific materials on silicon substrate. Typical materials to be analyzed are semiconductors, oxides, nitrides metals and photoresists.
The tool must be compatible with installation in an ISO 4 classified cleanroom. The tool must have an automatic mapping stage control system, and the stage must be suitable for 150 mm- and 200 mm silicon wafers. All parts needed for measuring 150 mm and 200 mm silicon wafers must be included in the offer.
The tool must be compatible with installation in an ISO 4 classified cleanroom. The tool must have an automatic mapping stage control system, and the stage must be suitable for 150 mm- and 200 mm silicon wafers. All parts needed for measuring 150 mm and 200 mm silicon wafers must be included in the offer.
The object of the tender process is described in more detail in the invitation to tender documents.
The object of this tender process has been described in more detail in Annex 1 “Technical properties and functionality, performance specifications and acceptance criteria” to this invitation to tender.
Kesto: 12 kuukautta
Oikeudelliset, taloudelliset, rahoitukselliset ja tekniset tiedot Osallistumisehdot
Kelpoisuus harjoittaa ammattitoimintaa: As stated in the invitation to tender documents.
Taloudellinen ja rahoituksellinen asema: Selection criteria as stated in the invitation to tender documents
Tekninen ja ammatillinen pätevyys: Selection criteria as stated in the invitation to tender documents
Sopimuksen toteuttaminen
Sopimuksen täytäntöönpanoehdot: As stated in the invitation to tender documents.
Menettely
Oikeusperusta: 32014L0024
Tarjousten vastaanottoaika: 12:00
Kielet, joilla tarjoukset tai osallistumishakemukset voidaan jättää: englanti 🗣️
Tarjouksen voimassaoloaika: 2023-02-28 📅
Tarjousten avauspäivä: 2022-11-17 📅
Tarjousten avausaika: 12:30
Lisätietoja:
The given date is preliminary. VTT reserves the right to change the scheduled date and time.
The opening of tenders shall not be a public event.
Täydentävät tiedot Arvostelurunko
Nimi: Markkinaoikeus
Postiosoite: Sörnäistenkatu 1
Postitoimipaikka: Helsinki
Postinumero: 00580
Maa: Suomi 🇫🇮
Puhelin: +358 295643300📞
Sähköposti: markkinaoikeus@oikeus.fi📧
Internetosoite: http://www.oikeus.fi/markkinaoikeus🌏
Lähde: OJS 2022/S 202-574294 (2022-10-14)
Ilmoitus tehdystä sopimuksesta (2023-08-28) Kohde Hankinnan laajuus
Viitenumero: Reg. no. 50/206/2022
Lyhyt kuvaus:
The object of the tender process was Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The basic use for equipment is to detect particles and other defects and scratches on unpatterned silicon wafers and different materials on silicon surface. The tool must be non-contact and non-destructive for determining particles and defects on the surfaces of specific materials on silicon substrate. Typical materials to be analyzed are semiconductors, oxides, nitrides metals and photoresists.
The tool must be compatible with installation in an ISO 4 classified cleanroom. The tool must have an automatic mapping stage control system, and the stage must be suitable for 150 mm- and 200 mm silicon wafers. All parts needed for measuring 150 mm and 200 mm silicon wafers must be included in the offer.
The object of the tender process was described in more detail in the invitation to tender documents.
The object of the tender process was Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The basic use for equipment is to detect particles and other defects and scratches on unpatterned silicon wafers and different materials on silicon surface. The tool must be non-contact and non-destructive for determining particles and defects on the surfaces of specific materials on silicon substrate. Typical materials to be analyzed are semiconductors, oxides, nitrides metals and photoresists.
The tool must be compatible with installation in an ISO 4 classified cleanroom. The tool must have an automatic mapping stage control system, and the stage must be suitable for 150 mm- and 200 mm silicon wafers. All parts needed for measuring 150 mm and 200 mm silicon wafers must be included in the offer.
The object of the tender process was described in more detail in the invitation to tender documents.
The object of the tender process was Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The object of the tender process was Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The object of the tender process was described in more detail in the invitation to tender documents.