Viimeaikaiset hankinnat, joissa toimittaja on mainittu Finetech GmbH and Co.KG
2022-04-27SUB MICRON ACCURAY FLIP CHIP DIE BONDE FOR RESEARCH AND SMALL VOLUME PRODUCTION (VTT Technical Research Centre of Finland Ltd)
The object of the tender process is a manual of semiautomatic flip chip die bonder with high placement accuracy and flexibility to different bonding technologies (later also “Equipment”). Main use is research and low volume bonding. Bonder must be able to handle wide scale of different chip sizes and capability to accurately control bond force. Accuracy should targeted below 1 um and advanced alignment features are key parameters. Besides of normal pad alignment also alignment to features around bonded …
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