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2020-05-12Inductively-coupled Plasma Reactive-ion Etching (ICP-RIE) Device (Aalto University Foundation sr)
Aalto University School of Electrical Engineering and School of Chemical Engineering are seeking a complete turn-key, stand-alone deep reactive ion etcher to be used in silicon etching. The equipment should be capable of running both close to room-temperature Bosch processes and cryo-processes without hardware changes in the equipment. The equipment should be capable of adjusting plasma power over wide range enabling high etch rate silicon etch processes, low damage shallow etching and black silicon …
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