Magnetron sputter (MST) system

Lisätietoja

Tampere University ('TAU') is procuring a system that enables to:

i) Metallization of semiconductor wafers and other substrates with high purity metals and pre-cleaning of substrate insitu in high vacuum towards optimal adhesion and low resistivity ohmic contacts,
ii) Deposition of ITO (Indium Tin Oxide) on various sample types such as glass and silicon.

* * *

Optoelectronics:
The system will be employed in the research of high-performance semiconductor devices to create high quality metal contacts to semiconductors and to provide i.e. solder layers that are used to interface devices to different type of chip carriers

The device wafers are typically wafers from 2” to 4” or fragments of these wafers with thickness variation from 100 µm to 650 µm. R&D of such devices requires system with fast cycle times, reproducibility and high-quality coatings. Removal of native oxide is important property.

Critical characteristics are also a user-friendly and intuitive user interface, enabling simple use of the system and effective process development.

* * *

Biomedical technology:
The system will be used for thin film coatings for various biomedical applications, especially microelectrode arrays and other sensors. 49 mm x 49 mm glass substrates are the current specialty, but also any other size and shape of glass, semiconductor and polymer substrates are possible up to 6-8” in diameter and few mm in thickness.

* * *

Overall:
The system under procurement should have an open platform in hardware and software level to enable TAU to further develop new processes. Moreover, the system should enable us to use it in a manual operation mode as well as automating a part or the complete process flow.

Maximum of three (3) most promising tenderers are selected to provide demonstration. E.g. Step coverage will be tested:
- Ultimately critical: Compatibility with lift-off resist processing.
- Step coverage to manage 2 µm steps (with vertical sidewalls) with conformal enough coatings to allow min 20 % of film thickness on sidewalls
- If system has capability for operator to adjust target-substrate distance these can be evaluated in extremes producing best results.

The system delivery process includes a design review step, in which TAU and the tenderer awarded with the contract, review the final system configuration.


- - - -

PRICING GUIDANCE:

Fixed budget of max 410 000 € (excl. VAT) to be utilized.
Tenderers are expected to maximize the offering within the budget.

Lisätietoja

Tampere University ('TAU') is procuring a system that enables to:

i) Metallization of semiconductor wafers and other substrates with high purity metals and pre-cleaning of substrate insitu in high vacuum towards optimal adhesion and low resistivity ohmic contacts,
ii) Deposition of ITO (Indium Tin Oxide) on various sample types such as glass and silicon.

* * *

Optoelectronics:
The system will be employed in the research of high-performance semiconductor devices to create high quality metal contacts to semiconductors and to provide i.e. solder layers that are used to interface devices to different type of chip carriers

The device wafers are typically wafers from 2” to 4” or fragments of these wafers with thickness variation from 100 µm to 650 µm. R&D of such devices requires system with fast cycle times, reproducibility and high-quality coatings. Removal of native oxide is important property.

Critical characteristics are also a user-friendly and intuitive user interface, enabling simple use of the system and effective process development.

* * *

Biomedical technology:
The system will be used for thin film coatings for various biomedical applications, especially microelectrode arrays and other sensors. 49 mm x 49 mm glass substrates are the current specialty, but also any other size and shape of glass, semiconductor and polymer substrates are possible up to 6-8” in diameter and few mm in thickness.

* * *

Overall:
The system under procurement should have an open platform in hardware and software level to enable TAU to further develop new processes. Moreover, the system should enable us to use it in a manual operation mode as well as automating a part or the complete process flow.

Maximum of three (3) most promising tenderers are selected to provide demonstration. E.g. Step coverage will be tested:
- Ultimately critical: Compatibility with lift-off resist processing.
- Step coverage to manage 2 µm steps (with vertical sidewalls) with conformal enough coatings to allow min 20 % of film thickness on sidewalls
- If system has capability for operator to adjust target-substrate distance these can be evaluated in extremes producing best results.

The system delivery process includes a design review step, in which TAU and the tenderer awarded with the contract, review the final system configuration.


- - - -

PRICING GUIDANCE:

Fixed budget of max 410 000 € (excl. VAT) to be utilized.
Tenderers are expected to maximize the offering within the budget.