The object of the procurement is an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end (later “equipment”) will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools. The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab. The object of the tender process is described in more detail in the invitation to tender documents.
Määräaika
Tarjousten vastaanottamisen määräaika oli 2022-08-19.
Hankinta julkaistiin 2022-06-16.
Toimittajat
Seuraavat toimittajat mainitaan hankintapäätöksissä tai muissa hankinta-asiakirjoissa:
hankintailmoitus (2022-06-16) Kohde Hankinnan laajuus
Otsikko: Teollisuus- tai laboratoriouunit, polttouunit ja muut uunit
Viitenumero: Reg. no 38/206/2022
Lyhyt kuvaus:
The object of the procurement is an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end (later “equipment”) will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab.
The object of the tender process is described in more detail in the invitation to tender documents.
The object of the procurement is an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end (later “equipment”) will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab.
The object of the tender process is described in more detail in the invitation to tender documents.
Menettely
Menettelyn tyyppi: Avoin menettely
Tarjouksen tyyppi: Tarjous koskee kaikkia eriä
Myöntämisperusteet
Kokonaistaloudellisesti edullisin tarjous
The given date is preliminary. VTT reserves the right to change the scheduled date and time.
The opening of tenders shall not be a public event.
Kohde Hankinnan laajuus
Lyhyt kuvaus:
The object of the procurement is an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end (later “equipment”) will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The object of the procurement is an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end (later “equipment”) will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab.
The object of the tender process is described in more detail in the invitation to tender documents.
Kesto: 12 kuukautta
Vaihtoehtojen kuvaus:
Additional desired feature of the equipment to be supplied are discussed in more detail in the invitation to tender documents.
Oikeudelliset, taloudelliset, rahoitukselliset ja tekniset tiedot Osallistumisehdot
Kelpoisuus harjoittaa ammattitoimintaa: As stated in the invitation to tender documents.
Taloudellinen ja rahoituksellinen asema: Selection criteria as stated in the invitation to tender documents
Tekninen ja ammatillinen pätevyys: Selection criteria as stated in the invitation to tender documents
Sopimuksen toteuttaminen
Sopimuksen täytäntöönpanoehdot: As stated in the invitation to tender documents.
Menettely
Oikeusperusta: 32014L0024
Tarjousten vastaanottoaika: 12:00
Kielet, joilla tarjoukset tai osallistumishakemukset voidaan jättää: englanti 🗣️
Tarjouksen voimassaoloaika: 2022-12-31 📅
Tarjousten avauspäivä: 2022-08-22 📅
Tarjousten avausaika: 09:00
Paikka: Espoo, Finland
Lisätietoja:
The given date is preliminary. VTT reserves the right to change the scheduled date and time.
The opening of tenders shall not be a public event.
Täydentävät tiedot Arvostelurunko
Nimi: Markkinaoikeus
Postiosoite: Sörnäistenkatu 1
Postitoimipaikka: Helsinki
Postinumero: 00580
Maa: Suomi 🇫🇮
Puhelin: +358 295643300📞
Sähköposti: markkinaoikeus@oikeus.fi📧
Internetosoite: http://www.oikeus.fi/markkinaoikeus🌏
Lähde: OJS 2022/S 118-332490 (2022-06-16)
Ilmoitus tehdystä sopimuksesta (2022-12-30) Kohde Hankinnan laajuus
Lyhyt kuvaus:
The object of the procurement was an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end. It will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab.
The object of the tender process was described in more detail in the invitation to tender documents.
The object of the procurement was an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end. It will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab.
The object of the tender process was described in more detail in the invitation to tender documents.
The object of the procurement was an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end. It will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The object of the procurement was an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end. It will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The object of the tender process was described in more detail in the invitation to tender documents.