The object of the procurement is an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end (later “equipment”) will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab.
The object of the tender process is described in more detail in the invitation to tender documents.
Määräaika
Tarjousten vastaanottamisen määräaika oli 2022-08-19.
Hankinta julkaistiin 2022-06-16.
Toimittajat
Seuraavat toimittajat mainitaan hankintapäätöksissä tai muissa hankinta-asiakirjoissa:
Kohde Hankinnan laajuus
Otsikko: OXIDATION, SINTERING, AND ANNEALING FURNACES
Reg. no 38/206/2022
Tuotteet/palvelut: Teollisuus- tai laboratoriouunit, polttouunit ja muut uunit📦
Lyhyt kuvaus:
“The object of the procurement is an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end (later...”
Lyhyt kuvaus
The object of the procurement is an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end (later “equipment”) will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab.
The object of the tender process is described in more detail in the invitation to tender documents.
1️⃣
Suorituspaikka: Suomi/Finland🏙️
Hankinnan kuvaus:
“The object of the procurement is an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end (later...”
Hankinnan kuvaus
The object of the procurement is an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end (later “equipment”) will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab.
The object of the tender process is described in more detail in the invitation to tender documents.
Näytä lisää Myöntämisperusteet
Hinta ei ole ainoa myöntämisperuste, ja kaikki perusteet ilmoitetaan ainoastaan hankinta-asiakirjoissa
Sopimuksen, puitesopimuksen tai dynaamisen hankintajärjestelmän kesto
Jäljempänä oleva aikataulu on ilmaistu kuukausina.
Kuvaus
Kesto: 12
Tietoa vaihtoehdoista
Vaihtoehdot ✅
Vaihtoehtojen kuvaus:
“Additional desired feature of the equipment to be supplied are discussed in more detail in the invitation to tender documents.”
Oikeudelliset, taloudelliset, rahoitukselliset ja tekniset tiedot Osallistumisehdot
Luettelo ja lyhyt kuvaus olosuhteista: As stated in the invitation to tender documents.
Taloudellinen ja rahoituksellinen asema
Luettelo ja lyhyt kuvaus valintaperusteista: Selection criteria as stated in the invitation to tender documents
Tekninen ja ammatillinen pätevyys
Luettelo ja lyhyt kuvaus valintaperusteista: Selection criteria as stated in the invitation to tender documents
Sopimukseen liittyvät ehdot
Sopimuksen täytäntöönpanoehdot: As stated in the invitation to tender documents.
Menettely Toimenpiteen tyyppi
Avoin menettely
Hallinnolliset tiedot
Tarjousten tai osallistumishakemusten vastaanottamisen määräaika: 2022-08-19
12:00 📅
Kielet, joilla tarjoukset tai osallistumishakemukset voidaan jättää: englanti 🗣️
Tarjouksen on oltava voimassa: 2022-12-31 📅
Tarjousten avaamista koskevat ehdot: 2022-08-22
09:00 📅
Tarjousten avaamista koskevat ehdot (paikka): Espoo, Finland
Tarjousten avaamista koskevat ehdot (Tiedot valtuutetuista henkilöistä ja avaamismenettelystä):
“The given date is preliminary. VTT reserves the right to change the scheduled date and time.
The opening of tenders shall not be a public event.”
Täydentävät tiedot Lisätietoja
“This notice has links and/or attachments listed in https://www.hankintailmoitukset.fi/en/public/procurement/72446/notice/103697” Arvostelurunko
Nimi: Markkinaoikeus
Postiosoite: Sörnäistenkatu 1
Postitoimipaikka: Helsinki
Postinumero: 00580
Maa: Suomi 🇫🇮
Puhelin: +358 295643300📞
Sähköposti: markkinaoikeus@oikeus.fi📧
URL: http://www.oikeus.fi/markkinaoikeus🌏
Lähde: OJS 2022/S 118-332490 (2022-06-16)
Ilmoitus tehdystä sopimuksesta (2022-12-30) Kohde Hankinnan laajuus
Lyhyt kuvaus:
“The object of the procurement was an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end. It will...”
Lyhyt kuvaus
The object of the procurement was an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end. It will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab.
The object of the tender process was described in more detail in the invitation to tender documents.
Näytä lisää
Hankinnan kokonaisarvo (ilman arvonlisäveroa): EUR 1 019 900 💰
Kuvaus
Hankinnan kuvaus:
“The object of the procurement was an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end. It will...”
Hankinnan kuvaus
The object of the procurement was an Atmospheric Oxidation, Sintering, Annealing furnace stack (4 tubes) for the VTT Micronova cleanroom front end. It will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd (VTT) and Aalto University for research, development and small-volume production of semiconductor devices. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.
The current main wafer size is 150 mm, but the equipment will gradually be renewed or upgraded, in order to facilitate a full process capability on 200 mm wafers by the end of the year 2024. Mainly silicon and quartz wafers are processed in the fab.
The object of the tender process was described in more detail in the invitation to tender documents.
Näytä lisää Myöntämisperusteet
Laatukriteeri (nimi): Quality
Laatukriteeri (painotus): 0
Hinta (painotus): 100
Menettely Hallinnolliset tiedot
Tätä menettelyä koskeva aiempi julkaisu: 2022/S 118-332490
Sopimuksen tekeminen
1️⃣
Otsikko: Oxidation, sintering, and annealing furnaces
Sopimuksen tekopäivä: 2022-09-23 📅
Tietoa tarjouskilpailuista
Saatujen tarjousten määrä: 3
Pk-yrityksiltä saatujen tarjousten määrä: 2
Sähköisesti vastaanotettujen tarjousten määrä: 3
Toimeksisaajan nimi ja osoite
Nimi: Tempress Systems BV
Kansallinen rekisterinumero: NL815183367B01
Postiosoite: Radeweg 31
Postitoimipaikka: MD Vaassen
Postinumero: 8171
Maa: Alankomaat 🇳🇱
Alue: Nederland 🏙️
Toimeksisaaja on pk-yritys ✅ Tiedot sopimuksen/erän arvosta (ilman alv:tä)
Sopimuksen/osuuden kokonaisarvo: EUR 1 019 900 💰
Lähde: OJS 2023/S 003-004983 (2022-12-30)