VTT amends the section General criteria, Requirements relating to the equipment, ‘Configuration, Priming Units/Modules’ of the invitation to tender.
The earlier requirement: ‘1 vacuum vapour priming unit for applying organic adhesion promoter (HMDS) on wafers prior to coating with photoresist. Temperature range: +60°C to +150°C.’ is amended.
The corrected requirement is: ‘1 priming unit for applying organic adhesion promoter (HMDS) on wafers prior to coating with photoresist. Temperature range: +60°C to +150°C. Contact angle of DI water on Si wafers after priming must be >65 degrees.’