Negotiated procedure for "Roll-to-Roll compatible component assembly and bonding capability for system-on-foil pilot production
The procurement concerns a manufacturing line or equipment combination intended to be used together in a Printed Hybrid Systems (PHS) /system-on-foil pilot production facility. The pilot line is a component assembly system capable of automatic bonding of various types of components such as very small bare chips, standard SMD components as well as large-area emerging flexible components onto flexible substrates in a reel-to-reel (R2R) compatible process.
The facilitiy is used for production technology research and concept prototyping, so the emphasis in all equipment acquisitions is more on the flexibility than on highly efficient throughput. However, as the goal is to build a pilot production line capable of making hybrid product batches of 100–10 000 pieces, the equipment and processes will need to be adequately efficient and also scalable to higher volumes (> 1 000 000 pcs/year).
With this announcement it is the intention to find an equipment manufacturer capable of producing or acting as a system integrator for the assembly equipment described below.
We aim to find a manufacturer capable of making equipment fulfilling the listed properties through possible negotiating procedure.
Määräaika
Tarjousten vastaanottamisen määräaika oli 2011-07-29.
Hankinta julkaistiin 2011-06-20.
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Hankintojen historia
| Päivämäärä |
Asiakirja |
| 2011-06-20
|
hankintailmoitus
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| 2012-03-26
|
Ilmoitus tehdystä sopimuksesta
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