Aalto University School of Electrical Engineering, Nanofab is responsible for maintaining the operation and capabilities of Aalto University cleanroom at Micronova. We seek a complete turn-key, stand-alone Femtosecond Laser Micromachining System capable of processing devices for multiple applications, including 3D micromilling, rapid surface patterning, thin film scribing, surface irradiation and welding, thus offering a flexible tool set for microelectronic, microelectromechanical, fluidic and optoelectronic devices. The materials to be processed will include among others metals, silicon, silicon carbide, sapphire and glass. A detailed definition of the requirements for the object of the contract is in Annex 1.
Määräaika
Tarjousten vastaanottamisen määräaika oli 2017-04-17.
Hankinta julkaistiin 2017-03-16.
hankintailmoitus (2017-03-16) Kohde Hankinnan laajuus
Otsikko: Laserin avulla toimivat työstökoneet sekä työstöyksiköt
Viitenumero: D/122/01.01.04.00/2017
Lyhyt kuvaus:
Aalto University School of Electrical Engineering, Nanofab is responsible for maintaining the operation and capabilities of Aalto University cleanroom at Micronova.
We seek a complete turn-key, stand-alone Femtosecond Laser Micromachining System capable of processing devices for multiple applications, including 3D micromilling, rapid surface patterning, thin film scribing, surface irradiation and welding, thus offering a flexible tool set for microelectronic, microelectromechanical, fluidic and optoelectronic devices. The materials to be processed will include among others metals, silicon, silicon carbide, sapphire and glass.
A detailed definition of the requirements for the object of the contract is in Annex 1.
Aalto University School of Electrical Engineering, Nanofab is responsible for maintaining the operation and capabilities of Aalto University cleanroom at Micronova.
We seek a complete turn-key, stand-alone Femtosecond Laser Micromachining System capable of processing devices for multiple applications, including 3D micromilling, rapid surface patterning, thin film scribing, surface irradiation and welding, thus offering a flexible tool set for microelectronic, microelectromechanical, fluidic and optoelectronic devices. The materials to be processed will include among others metals, silicon, silicon carbide, sapphire and glass.
A detailed definition of the requirements for the object of the contract is in Annex 1.
Menettely
Menettelyn tyyppi: Avoin menettely
Tarjouksen tyyppi: Tarjous koskee kaikkia eriä
Myöntämisperusteet
Kokonaistaloudellisesti edullisin tarjous
Aalto University School of Electrical Engineering, Nanofab is responsible for maintaining the operation and capabilities of Aalto University cleanroom at Micronova.
We seek a complete turn-key, stand-alone Femtosecond Laser Micromachining System capable of processing devices for multiple applications, including 3D micromilling, rapid surface patterning, thin film scribing, surface irradiation and welding, thus offering a flexible tool set for microelectronic, microelectromechanical, fluidic and optoelectronic devices. The materials to be processed will include among others metals, silicon, silicon carbide, sapphire and glass.
We seek a complete turn-key, stand-alone Femtosecond Laser Micromachining System capable of processing devices for multiple applications, including 3D micromilling, rapid surface patterning, thin film scribing, surface irradiation and welding, thus offering a flexible tool set for microelectronic, microelectromechanical, fluidic and optoelectronic devices. The materials to be processed will include among others metals, silicon, silicon carbide, sapphire and glass.
A detailed definition of the requirements for the object of the contract is in Annex 1.
Arvioitu kokonaisarvo: 400 000 EUR 💰
Lyhyt kuvaus:
General purpose of tool:
Femtosecond Laser micromachining system to be purchased can be used for multiple applications, including 3D micro-milling, rapid surface patterning, thin film scribing, surface irradiation and welding, thus offering a flexible tool set for microelectronic, microelectromechanical, fluidic and optoelectronic devices. The materials to be processed will include among others metals, silicon, silicon carbide, sapphire and glass.
Femtosecond Laser micromachining system to be purchased can be used for multiple applications, including 3D micro-milling, rapid surface patterning, thin film scribing, surface irradiation and welding, thus offering a flexible tool set for microelectronic, microelectromechanical, fluidic and optoelectronic devices. The materials to be processed will include among others metals, silicon, silicon carbide, sapphire and glass.
Installation site:
The laser micromachining tool will be installed in a laboratory which is not dedicated for just laser operation and thus the system must be enclosed in a class 1 laser enclosure.
Equipment and operation:
The laser micromachining should be equipped with a main unit (frame, laser source, optics, stage and galvanometric scanner), power supply rack, vacuum pumps, operation console, software (OS, writing preparation, machine control) and accessories to allow for example the following features:
The laser micromachining should be equipped with a main unit (frame, laser source, optics, stage and galvanometric scanner), power supply rack, vacuum pumps, operation console, software (OS, writing preparation, machine control) and accessories to allow for example the following features:
— -- Process samples of different sizes (from small pieces to 150 mm wafer)
— -- Import mask file from GDSII, OAS and other general formats and prepare data for processing
— -- Find and recognize alignment marks from previous exposure and realize overlay exposure (Mix-and-Match)
— -- Process features larger than the galvo-scanner write field by automatically
breaking the pattern to be written to smaller sections and processing these with the combined movement of galvo and x-y -stages (Step-and-scan)
— -- Preferably the system is equipped with multiple (2 or more) output wavelengths and changing between these wavelengths is done at the control software level without any physical intervention.
Kesto: 7 kuukautta
Menettely
Tarjousten vastaanottoaika: 13:00
Kielet, joilla tarjoukset tai osallistumishakemukset voidaan jättää: englanti 🗣️
suomi 🗣️
Tarjouksen voimassaoloaika: 4 kuukautta
Tarjousten avauspäivä: 2017-04-17 📅
Tarjousten avausaika: 13:00
Hankintaviranomainen Tunnistetiedot
Kansallinen rekisterinumero: 2228357-4
Muu hankintaviranomaisen tyyppi: university foundation
Yhteystiedot
Yhteyspiste: Janne Antson
Asiakirjojen URL-osoite: https://hanki.tarjouspalvelu.fi/hanki🌏