Viimeaikaiset hankinnat, joissa toimittaja on mainittu EV Group Europe and Asia Pacific GmbH
2015-02-19Wafer bonder and bond aligner (Teknologian tutkimuskeskus VTT Oy)
The equipment being sought is primarily used for bonding of 150 and 200 mm silicon wafers with metal seal ring structures. It needs to have bond alignment option either as integrated tool or as separate bond aligner and bonder. The tool should offer sufficient bonding conditions (force, temperature, chamber pressure) to enable high yield thermocompression and eutectic bonding. The tool should be easy to use and provide fast and reliable operation. The tool should also offer process flexibility as it is …
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